FCC Chairman proposes 100MHz spectrum reallocation in C-band●REPAIR Act advances in Senate Commerce Committee●TSMC announces $65B Arizona fab expansion, seeks federal support●California CPPA issues draft enforcement regulations for AI data brokers
CHIP SUPPLY CHAIN
Reporting on the CHIPS Act implementation, semiconductor supply chain risk, fab investment and U.S.-China technology trade policy.
The Federal Communications Commission processed 20 filings of regulatory significance on May 16, 2026, spanning Broadband & 5G, FCC & Spectrum, and Chip Supply Chain.…
The Federal Communications Commission processed 20 filings of regulatory significance on May 15, 2026, spanning Broadband & 5G, FCC & Spectrum, and Chip Supply Chain.…
The Federal Communications Commission processed 12 filings of regulatory significance on May 14, 2026, spanning FCC & Spectrum, Chip Supply Chain, Broadband & 5G, and…
The Federal Communications Commission processed 21 filings of regulatory significance on May 13, 2026, spanning FCC & Spectrum, Broadband & 5G, and Chip Supply Chain.…
The Federal Communications Commission processed 26 filings of regulatory significance on May 12, 2026, spanning FCC & Spectrum, Chip Supply Chain, and Broadband & 5G.…
The CHIPS and Science Act has directed $26 billion in confirmed awards to TSMC, Intel, Samsung, and Micron for U.S. fab construction. TSMC Arizona Phase 1 is in volume production at 92 percent yield; Intel Ohio has slipped to 2030; Samsung Taylor targets 2026.
BIS issued its broadest semiconductor export controls in October 2022, blocking China from acquiring advanced AI chips and fabrication equipment. Three years of rule iterations, Entity List expansions, and Trump administration reversals have reshaped global chip trade.
Global foundry capacity splits along a fault line: AI demand has absorbed leading-edge nodes while legacy 28nm-and-above tiers — the substrate for most IoT and automotive chips — recover from a structural shortage that exposed a decade of underinvestment.
The CHIPS and Science Act (Pub.L. 117-167) appropriates $52.7 billion for domestic semiconductor manufacturing and R&D. Commerce has issued over $33 billion in direct manufacturing awards to TSMC, Intel, Samsung, Micron, and others. BIS export controls under 15 C.F.R. Parts 730-774 restrict advanced chip technology transfers to China.